Athlete FA Corporation continues to develop assembly equipment for the semiconductor, electric vehicle, telecommunications and medical fields, using state-of-the-art technology and demonstrating an unwavering commitment to quality.
At the heart of Japan’s manufacturing lies Athlete FA Corporation, a company deeply entrenched in the ethos of precision engineering and technological advancement. Led by Susumu Yamazaki, the president of the company, Athlete FA Corporation stands as a beacon of Japanese manufacturing excellence amidst the shifting tides of global economics and demographics.
Highlighting the company’s commitment to superior technology and adherence to high Japanese standards, Mr. Yamazaki states: “I think the greatest weapons we have are our superior technology and our high Japanese standards. With that arsenal of technology and quality, we do business with some of the biggest companies in the world.”
Discussing future growth prospects, Mr. Yamazaki identifies advanced computing, data centers, and semiconductor industries as areas poised for significant growth, adding: “Data centers, servers, and cloud computing are all booming right now. These three industries are all expected to experience significant growth going forward.”
Delving into the company’s product portfolio, Mr. Yamazaki provides insights into the Micro Ball Mounter (BM-2150SI). “This equipment uses advanced printing and ball mounting technology to achieve an array of solder balls as small as 30 μm in diameter,” he explains. “It has been well received by users around the world for its perfect performance under various conditions, such as board size, board thickness, and board warpage.”
When discussing the mass-production Flip Chip Bonder (CB-3000), Mr. Yamazaki elaborates on the calibration function: “There is a built-in mechanism for self-adjustment and fine-tuning of the default settings. Errors are corrected and the equipment is able to provide the best performance. And to get there, this equipment is also reviewed, verified, and checked at every step of the process, ultimately delivering the highest speed and accuracy.”
The company president also touches upon the significance of supporting both eight and twelve-inch wafers with their high-accuracy Die Bonder (AB-1000). He explains: “This equipment has demonstrated performance that exceeds expectations, with a maximum die size of 2.5 mm on the board side and chip sizes as small as 0.50 mm to 1 mm to be mounted.”
Athlete FA Corporation has experienced remarkable revenue growth, with sales increasing at an annual rate of 50% since 2020. Looking ahead, Mr. Ya
